Leading Company of Wafer Transfer Equipment
PHT contribute your automation efficiency as a leading wafer transfer
equipment company with hightest quality and technology
Back and forth (X-axis), swivel (θ-axis), up-and-down (Z-axis) + hand rotation (0 to 180°) operations are possible, supporting wafer transfer in the atmosphere. The drive motor is an AC servomotor with absolute encoder specifications for all axes.
This system replaces the dicing frame for 200mm and 300mm stored in a specified cassette with a standard cassette. The cassettes used are 6-sheet cassettes and 13-sheet cassettes. Each cassette is supplied to the stage by an operator.
As an additional function, it is possible to read the wafer ID laser-marked on the wafer surface and add an alignment function. Wafers of 200 mm and 300 mm can be handled depending on the carrier used and function. Supports face to face transfer and back to back transfer.
This is a device that separates the wafer from the plate jig (beam) after wire sawing (slicing). This is a fully automated system that performs rough cleaning, separates wafers from plate jigs (beams), single-wafer cleaning, and wafer cassette storage.
Semiconductor devices are built up by repeating microfabrication technology on high-purity single-crystal structure silicon substrates called wafers. As a specialized manufacturer of in-process wafer transfer equipment, inter-process wafer transfer equipment, and stocker transfer equipment for semiconductor manufacturing equipment, PHT supports the manufacturing process of 300mm wafers for advanced devices and 200mm wafers for IoT and automotive applications.
In semiconductor manufacturing, it is a process of manufacturing equipment production process. PHT utilizes top-level robot technology to produce semiconductor manufacturing equipment and deliver it to top manufacturers. Since the robot has a wafer mapping function, it is possible to detect the presence of wafers on the OPEN carrier side. Even equipment that has been in operation for over 20 years is operating normally, with no metal contamination or increase in particles. It supports the advancement of semiconductor functionality and performance.
PHT Co., Ltd., which has the world's top market share for automatic wafer delamination equipment, has utilized silicon wafer transport and laser processing technology to deliver next-generation SiC (silicon carbide) and GaN (gallium nitride) materials, as well as transport solutions (robots) for compound semiconductors. ・Conveyor (conveyor or transfer equipment, EFEM, SORTER, automatic peeling/cleaning equipment, cleaning equipment) is proposed, and we are actively approaching the power semiconductor market in particular. PHT has created a system to provide comprehensive solutions for semiconductor manufacturing equipment for energy conservation (electric vehicles, power control).
The competitiveness of PHT's semiconductor cleaning equipment is the world's first modularization of each unit. The main purpose of cleaning in the pre-process is to remove contaminants generated in each process, and the main purpose of cleaning in the post-process is to remove particles and metals. A typical cleaning method is a cleaning method called RCA cleaning. Utilizing top-level technology, we produce semiconductor manufacturing equipment and have a track record of delivery to top manufacturers. Can be used in all wet processing processes.