Products

Wafer Transfer Device

Semiconductor manufacturing requires high-speed transportation in an extremely clean environment. The wafer transport equipment used in the semiconductor processing equipment we provide has been innovatively designed to meet such demands ahead of other companies. Its high reliability and productivity have been evaluated by our worldwide customers. As the leading industry standard device, it continues to evolve to meet the latest technology and diverse needs.

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Wafer Transfer Device PWT2020

This is a system that utilizes clean robots.
It transports 300mm wafers one by one from Cassette (container) A to B.
The compatible cassettes (containers) are FOUP, FOSB, OPEN, and PFA.
Although single wafer transport is standard, it can also support 5-piece and 25-piece transport.
We will safely transport wafers in bulk and specify slots for transport (transport within the same carrier is possible) between cassettes.
By lifting the wafer from the cassette to load/unload, it minimizes contact with the cassette, preventing wear, dust generation, and damage to the wafer edge. It detects loading errors such as positional misalignment of the wafer and double stacking through wafer mapping. It is equipped with an operation error prevention sensor and an emergency button.

Specifications

Work
Semiconductor Wafer
Power Supply
AC200V, 15A
Device Weight
Approximately 500kg
Work Thickness
600-850μm
Work Size
300mm
Throughput
25 sheets/1 cassette transfer time, less than 300 seconds
Drive Method
Motor Drive (Servo)
Device Size
W1000 × D1400 × H1800 (mm)
Cassette (Container)
FOUP, FOSB, OPEN, PFA
Transfer Unit
1 sheet unit, 5 sheets unit, 25 sheets unit
Safety Mechanism
Cassette presence or absence, wafer presence or absence, overload detection, abnormal alarm, emergency stop
T Option
Static electricity removal device (Ionizer), Full cover, Area sensor
ID reader, Alignment, Wafer flip etc.

Device Features

  • Space-saving
  • Anti-static type
  • Error monitoring with light and mechanical sensors
  • Equipped with a mapping sensor
  • Compatible with FOUP, FOSB, and H-Square manufactured metal cassettes
  • Class 10 clean room compatible

Implementation Examples

Want to transport wafers simply
Want to reduce friction in the cassette work

Considerations

Number of cassette stages, automation, work size, etc.

Device Usage

Cases when used by device manufacturer
  • ① Evaluation wafers are supplied by the device manufacturers in FOSB (shipping cases).
  • ② Transfer is made to the carriers used in the manufacturer's system (for example, FOUP).
  • ③ The evaluated wafers are transferred back to FOSB (for return to the device manufacturer).

Examples of device manufacturers

Etching device, ashing device, cleaning device, coater developer, exposure device, etc.

Cases when used by wafer manufacturers
  • ① Completed wafers (after final cleaning and inspection) are transferred to FOSB (shipping cases).
  • ② Between processes (such as cleaning process), they are switched to PFA carriers (cleaning carriers).

12" Compatible Single Wafer Quartz Glass Wafer Transfer Equipment PGT2020

This device is a system that automatically transfers Ø300mm (12") quartz glass wafers from stage 1 to stage 2 in a leaf-type manner.
The cassettes used are FOUP and FOSB carriers.
In principle, the carrier is set on the stage by the operator.
Air cleanliness: ISO Class3 (ISO-14644)

Device Overview

Throughput
  • When performing notch alignment
  • Takt time / Transfer time: 6 minutes 30 seconds / 25 sheets or less
Processed Material
Wafer
  • Ø300mm Quartz Glass Notch
  • Diameter Ø300mm ± 0.2mm
  • Thickness 400 - 700 μm
  • Warp 40 μm or less
  • Contactable Range: Backside of the wafer
Carrier
  • Auto Door FOSBType: Specified Product
  • FOUPType: Specified Product
  • Wafer Storage Pitch10 mm
Specifications of Each Part
Specifications of Each Part（1）

Stage 1 (Loader)

  1. Stage on the left front side of the device
  2. Compatible Carriers
    • ① Auto Door FOSB, Wafer storage pitch 10mm × 25 sheets
    • ② FOUP SEMI standard product, Wafer storage pitch 10mm × 25 sheets
  3. Sensor Functions
    • ① Install a transmissive mapping sensor for confirming the presence of wafers in the cassette.
Specifications of Each Part (2)

Stage 2 (Unloader)

  1. Stage on the right front side of the device
  2. Compatible Carriers
    • ① Auto Door FOSB, Wafer storage pitch 10mm × 25 sheets
    • ② FOUP SEMI standard product, Wafer storage pitch 10mm × 25 sheets
  3. Sensor Functions
    • ① Install a transmissive mapping sensor for confirming the presence of wafers in the cassette.
Specifications of Each Part (3)

Wafer Transfer Robot

  1. Operation: Expansion, rotation, and up-and-down movement 3-axis robot (servo motor-driven).
  2. Robot Hand: Made of CFRP, wafer contact part is PEEK, edge hold method.
  3. Wafer transfer specification: Basically, it goes from the bottom of the cassette to extraction, then to the top for storage.
  4. Parallel transfer and extraction is also possible.