Products

Wafer Automatic Cleaning Equipment (Batch Type & Single-Wafer Type) SCC-250

A batch device that provides optimal customization based on a wide range of field experiences.
※For compatibility with SiC wafers, it is necessary to discuss specifications separately.

In addition to batch-type cleaning equipment, our company also has extensive experience in the development and manufacturing of single-wafer cleaning equipment. In particular, we specialize in the development and production of single-wafer cleaning equipment for compound semiconductors such as SiC, GaN, and InP, and we offer optimal solutions tailored to meet our customers' process requirements.

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Specifications

Wafer Size
Ø200mm・Ø300mm
Wafer Material
Silicon (For compound semiconductors such as SiC, separate specification discussions are necessary)
Treatment Tank and Configuration
Separate specification discussions according to line configuration
HEPA or ULPA
Quantity determined by configuration
Chemical Temperature
Can handle up to 100℃
Chemical Tank
Oscillating, Rotating, Ultrasonic
Rinse Tank
Bubbling, QDR, resistivity meter installation
LD & ULD
Ionizer (Option)
Drying
Hot water lift, IR, spin dryer, Marangoni
Optional Equipment
Ozone generator
Utilities
Pure water, Nitrogen (for air sensor), Clean air, Power supply, Vacuum (for transport)
Robot

Manufactured by PHT or PHOENIX ENGINEERING

Upper and lower axis (AC servo drive) + Travel axis (AC servo drive) + Chuck mechanism (air drive)
Chemicals
O3・HF・NCW・KOH・NH4OH・H2O2・HCL・EDTA・HCL・Citric Acid・DIW

Features

  • Realizes the optimal process with a simple treatment tank structure.
  • Inter-tank transport corresponds to a control system that allows transport in the shortest distance in the shortest time.
  • Component layout considering maintainability.
  • Design towards process optimization based on abundant experimental data is possible.
  • We provide the optimal custom device according to your needs.

Supported Processes

  1. Post-Lapping Cleaning Device: Removal of lapping abrasive grains (mainly alkaline and interface cleaning).
  2. Alkaline Etching Cleaning Device: A cleaning device aimed at removing processing distortion after grinding.
  3. Pre-Heat Treatment Cleaning Device: Based on RCA cleaning, but varies depending on the user's line configuration.
  4. Post-Heat Treatment Cleaning Device: Based on RCA cleaning, but varies depending on the user's line configuration.
  5. Post-Polishing Cleaning Device: Basic RCA cleaning (DHF・SC-1・SC-2・O3 treatment).
  6. FINAL Cleaning: Basic RCA cleaning (DHF・SC-1・SC-2・O3 treatment).