Products

Carrier Substrate Receiving Cleaning Device PWG-2501

Cutting-edge chiplet packaging technology for next-generation semiconductors is being developed, and glass substrates are expected to be applied as carrier substrates for packaging. Proposals for the transportation and cleaning equipment for these glass carrier substrates are possible.

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Specifications

Input Conveyor Section
□ 600mm × plate thickness 0.7～1.2mm, can input one piece
Idle Position
Waiting section for cleaning input, with exhaust function
Shower (1)
Pure water shower + dual-fluid nozzle cleaning
Brush Cleaning Section
Pure water shower cleaning + spiral roll brush
Shower (2)
Rinse cleaning with pure water
Shower (3)
Final rinse cleaning with pure water
Water Cut Roller Section
Water cutting by absorbent roller
Air Drying Section
Drying by air knife
Ionizer
Ionizer blow drying

※ As an option, it is also possible to input sheet by sheet from cassette magazine to robot.

Introduction Example

This device is used for cleaning incoming glass substrates. Only pure water (DIW) is used without any chemicals.

Cleaning Process and Device Configuration
The process is in the following order.
(1) Input Conveyor → (2) Idle → (3) Dual Fluid Shower Cleaning → (4) Brush Cleaning → (5) Pure Water Shower Cleaning → (6) Final Rinse Cleaning with Pure Water → (7) Water Cutting by Absorbent Roller → (8) Slit Nozzle Drying by Air Knife → (9) Ionizer Blow Drying. It comes with LD & ULD (Load Port Included).