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This is an automatic wafer demounter machine after wire saw (slicing). By setting the ingot adhered to the plate jig on the input side, it is a system that performs coarse cleaning, wafer Demounter, wafer leaf cleaning, drying, and cassette storage all automatically. The plate jig after demounter is discharged on the unloader side.
The Demounter is done by hot air heating method, one by one. The peeled wafer is cleaned by a sheet method. After high-pressure cleaning with two fluids, scrub cleaning, rinse cleaning, water absorption roller drying, and slit nozzle drying, each wafer is stored in the cassette of the unloader part by a horizontal multi-joint robot. The storage can be selected from the upper or lower part of the cassette (25 pieces). The storage cassette can hold up to 6 pieces. It supports OHT transport.
Want to automate manual demounter
Want to manage wafer information
Number of cassette stages, automation, work size, design compatible with input lifters, etc.