Batch Type Wafer Cleaner | PHT Inc. | Design, manufacture and sale of semiconductor wafer transfer robot ・wafer cleaner and laser application related equipment | Transfer and cleaning solutions for silicon wafers, SiC, GaN power semiconductors, and compound semiconductors

Batch Type Wafer Cleaner SCC-250

Overview

Cleaning device after lapping: Removal of lapping abrasive grains (cleaning mainly with alkaline + interface).
Alkaline etching cleaning equipment: Cleaning equipment for the purpose of removing processing distortion after grinding.
Pre-heat treatment cleaning equipment: Basically RCA cleaning, but it depends on the user's line configuration.
Post-heat treatment cleaning equipment: Basically RCA cleaning, but it depends on the user's line configuration.
Post-polishing cleaning equipment: RCA cleaning is the basis. (DHF/SC-1/SC-2/O3 treatment)
FINAL cleaning: RCA cleaning is the basis. (DHF/SC-1/SC-2/O3 treatment)

Equipment introduction

Silicon wafer (8″・12″) batch type automatic cleaning equipment introduction
A batch-type device that performs optimal customization with a track record in a wide range of fields.

Number of sheets processed	There are two types, 25 sheets and 50 sheets.
Conveying method	Select from carrier type or carrierless type.
Cleaning method	The process used determines the composition of the cleaning bath.
Robot	Decide the number according to the process. Equipped with up/down, travel, and chuck drive.
LD＆ULD	Compatible with PFA, OPEN, FOSB, and FOUP cassettes. The 8″ wafer pitch is 6.35mm. The 12″ wafer pitch is 10mm. The specifications are determined according to the application and layout.
Pitch conversion	In the case of 12″ wafer cleaning, in order to reduce the volume of the cleaning tank Convert wafer pitch from 10mm to 7mm or 5mm.
Drying method	Select from hot water drying, IR drying, and spin dryer.
Equipment in general	Frame/Stand A steel-frame welded structure that is wrapped around after corrosion-resistant coating. FFU (clean unit) is installed on the upper part.
Processing time	1 batch (25 sheets or 50 sheets) 5 minutes (300 sec) to 6 minutes (360 sec).
Equipment specifications
Wafer size	φ200mm・φ300mm
Wafer material	Silicon (Compound semiconductors such as SiC require a separate meeting for specifications.)
Treatment tank and configuration	Separate specification meeting depending on line configuration
HEPA or ULPA	Quantity determined by configuration
Robot	PHT or PHOENIX ENGINEERING: Vertical axis (AC servo drive) + travel axis (AC servo drive) + chuck mechanism (air drive)
Chemical solution	O₃・HF・NCW・KOH・NH₄OH・H₂O₂・HCL・EDTA・HCL・Citric acid・DIW
Chemical solution temperature	Capable of handling up to 100°C
Chemical bath	Pendulum swing/rotation/ultrasound
Rinse bath	Bubbling, QDR, resistivity meter installation
LD＆ULD	Ionizer (option)
Drying	Hot water extraction/IR/Spin dryer/Marangoni
Utilities	Pure water, nitrogen (for air sensor), clean air, power supply, vacuum (for transfer)
Optional equipment	Ozone generator
Process performance specification
Adhering particle count	10 pieces/wafer (size of 0.15um or more) or less However, it is affected by the user's facility.
Metal contamination	Out of warranty
Etch uniformity	Out of warranty
Competitiveness of cleaning equipment made by PHT
Each unit of the cleaning equipment is modularized. The processes include cleaning after wire saw, cleaning after lapping, alkaline etching cleaning, DSP cleaning, and final cleaning. We are good at post-wire saw cleaning, DSP cleaning, and FINAL cleaning. In general, wafer cleaning (final cleaning) is considered NG (defective) if the number of particles on the surface of a φ300 mm wafer is less than 10. Particle size is 0.1μm or more.
Features
High process performance	Realize the optimum process with a simple treatment tank structure.
High throughput	Conveyance between tanks is compatible with a control system that conveys the shortest distance in the shortest time.
Improved maintainability	Parts layout considering maintainability
Equipment design	Design for process optimization based on abundant experimental data is possible
Wealth of achievements	We will provide the most suitable custom equipment according to your needs.
Correspondence process
We support cleaning after wire saw, cleaning after lapping, alkaline etching cleaning, cleaning before heat treatment, cleaning after heat treatment, cleaning after polishing, and final cleaning.