Semiconductor manufacturing requires high-speed transportation in a very clean environment. Various innovations have been made ahead of other companies to meet such demands for the automatic wafer delamination equipment used in the semiconductor processing equipment provided by our company. Its high reliability and productivity are highly evaluated by customers worldwide. As a state-of-the-art industry standard equipment, we continue to evolve to meet the latest technology and diverse needs.
This device separates the wafer from the plate jig (beam) after wire sawing (slicing). This is a fully automated system that performs rough cleaning, separates wafers from plate jigs (beams), single-wafer cleaning, and wafer cassette storage.
This is an automatic wafer peeling device after wire sawing (slicing). By setting the ingot bonded to the plate jig on the loading side, this system fully automates the process from rough cleaning to wafer peeling to wafer single wafer cleaning to drying to cassette storage. After peeling, the plate jig is discharged to the unloader side.
Peeling is done one by one by hot air heating method. Wafers after delamination are cleaned using the single-wafer method. After 2-fluid high-pressure washing, scrubbing, rinsing, water absorption roller drying, and slit nozzle drying, the horizontal articulated robot stores each sheet in the unloader's cassette. Storage can be selected from the upper and lower stages of the cassette (25 pieces). The maximum number of storage cassettes is 6. Supports OHT transportation.
Want to automate manual peeling
Want to manage wafer information
Number of cassette stages, automation, work size, design for input lifter, etc.
|Wafer Automatic Peeling Device PWD2010||Wafer Automatic Peeling Device PWD2020|
|Constitution||Peeling part||Peeling part||Peeling part||Peeling part|
|Cleaning part 1||Cleaning part 1||Cleaning part 1||Cleaning part 1|
|Cleaning part 2||Cleaning part 2||Cleaning part 2||Cleaning part 2|
|Wafer transfer part||Wafer transfer part||Wafer transfer part||Wafer transfer part|
|Conveying section||Conveying section|
|Storage||Cassette (25 sheets)|
|Storage Cassette||Up to 6 (consideration possible)|
|Plate jig||Made by NTC ・ Made by MB|
|Drive system||Motor drive (servo)|
|Safety mechanism||Presence of cassette, presence of wafer, overload detection, error alarm, emergency stop|
|Power supply||AC200V, 100A|
|Equipment weight||About 5,000kg|
|Options||Loader ID reader, unloader RFID, wafer reversal, storage in multiple cassettes, area sensor, etc.|